Mueon is developing next-generation semiconductor technology using modular 3D chiplet packaging to dramatically improve computing performance and energy efficiency for AI data centers.
Its Cubelets technology brings compute, memory, power delivery, and cooling into tightly integrated, three-dimensional building blocks. By moving these components closer together, using lower-voltage power delivery and two-sided cooling, Mueon reduces the energy and time required to move data while enabling greater computing density. The company is targeting up to 10x improvement in performance per watt within the same rack footprint.
“Oregon Venture Fund believed Mueon’s vision early and has been much more than a capital partner. From helping us navigate the early stages of building the company to opening doors to investors, and the local ecosystem, the OVF team has brought valuable insights, connections, and support. Having investors who understand both the semiconductor industry and the challenges of building a startup has made a real difference in our journey.”
OVF was an early seed investor in Mueon and has continued to back the company through multiple rounds. What excited us was the combination of deep expertise in advanced semiconductor packaging, a flexible, vendor-agnostic architecture, and the opportunity to rethink how AI data center infrastructure is built. OVF invested in Mueon in 2025. Read the full article and learn why we invested here.
Read more about OVF’s approach to investing on our perspectives page.
Advice for Entrepreneurs from Mueon CEO, Wilfred Gomes
"Stress test your idea with early investors, end customers and potential employees and especially the nay sayers. If you cannot describe the plan in a ten second elevator pitch and get them excited to join you with full enthusiasm, then you are not ready."